Special Issue on Research on Emerging Technologies in Design and Manufacturing

Submission Deadline: Mar. 25, 2020

Please click the link to know more about Manuscript Preparation: http://www.engandsci.org/submission

Please download to know all details of the Special Issue

Special Issue Flyer (PDF)
  • Lead Guest Editor
    • Bharath V G
      Department of Mechanical Engineering, CMR University, Bangalore,  Karnataka, India
  • Guest Editor
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to complete the Guest Editor application.
    • Rajashekar Patil
      Department of Mechanical Engineering, CMR University, Bangalore,  Karnataka, India
    • Shantharaja M
      Department of Mechanical Engineering, UVCE, Bangalore University, Bangalore,  Karnataka, India
    • Kotresh Sardar
      Department of Mechanical Engineering, RYMEC, Visvesvaraya Technological University, Bangalore,  Karnataka, India
    • Department of Mechanical Engineering, Sapthagiri College of Engineering, Visvesvaraya Technological University, Bangalore,  Karnataka, India
    • Y. Arun Kumar
      Department of Mechanical Engineering, Malnad Engineering College, Visvesvaraya Technological University, Bangalore,  Karnataka, India
    • G R Rajkumar
      Department of Mechanical Engineering, RVCE, Visvesvaraya Technological University, Bangalore,  Karnataka, India
    • Samkit Shah
      Department of Automobile & Mechanical, ITM Universe, Vadodara, Gujarat, India
      Department of Mechanical Engineering,School of Engineering, Hellenic Mediterranean University, Heraklion, Greece
    • Kenneth Coker
      School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
    • B A G Yuvaraju
      Department of Mechanical Engineering, National Institute of Technology Rourkela, Rourkela, Odisha, India
  • Introduction

    In present, engineers, manufacturers, entrepreneurs and educationalist focused on fourth industrial revolution, which has been broadcast under various labels, such as Enterprise 2.0, the Factory of the Future, Industry 4.0 and the Smart Factory. Technologies and concepts enabling this latest stage of development include artificial intelligence, robotics, nanotechnology, additive technologies such as 3D printing, big data analytics, and the internet of things and services (IoT/S).
    The special issue will deal with all aspects of the design, manufacturing, analysis and optimization of products in mechanical systems.
    Topics of interest include:
    1. 3D Printing
    2. Virtual Reality
    3. Augmented Reality
    4. Mixed Reality
    5. Digital Manufacturing
    6. Collaborative Manufacturing
    7. Recent advances in composite materials
    8. Recycling of composite materials
    9. Product life cycle management
    10. Artificial Intelligence
    11. Internet of Things
    12. Advances in Thermal Engineering
    13. Nano Technology

    Aims and Scope:

    1. Digital Manufacturing
    2. Virtual Manufacturing
    3. Internet of Things
    4. Collaborative Engineering
    5. CAD/CAM/CAE
    6. Composite Materials

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.engandsci.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepg.org/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.